Dielectric and Thermal Behaviour Analysis of Epoxy Composites Filled with Date Seed Particles Using Finite Element Method

Document Type : Research Article

Authors

1 Department of Electrical Engineering, Synergy Institute of Engineering and Technology, Dhenkanal, Odisha, India

2 Department of Mechanical Engineering, Synergy Institute of Engineering and Technology, Dhenkanal, Odisha, India

3 School of Mechanical Engineering, KIIT Deemed to be University, Bhubaneswar, Odisha, India

4 Department of Mechanical Engineering, Galgotias University, Greater Noida, Uttar Pradesh, India

5 School of Mechanical Engineering, Vellore Institute of Technology, Vellore, Tamil Nadu, India

Abstract

This study reports the thermal and dielectric behaviours of epoxy composites filled with date seed particles. DSP-epoxy composites are fabricated by adding date seed powder into epoxy resin at varying weight (0-25 %) and volume (0-17.95 %) fractions using a hand layup technique. The thermal conductivity of the composites is measured by UnithermTM2022 and HIOKI-3532-50 Hi Tester ElsierAnalyzer determines the dielectric constant. The finite element method (FEM) using Digimat FE software is used to simulate the thermal conductivity of the DSP-epoxy composites. The result showed that the thermal conductivity of the epoxy reduced by 27 % from 0.362 W/ m-K to 0.261 W/ m-K with the addition of 17.95 vol. % of DSP. The FEM-predicted values are found to be closest to the measured values, with an error range of 6-10%. The dielectric constant of the composites increased with the addition of DSP content across all frequency ranges due to interfacial and dipolar polarization. However, the dielectric constant decreased at high frequencies due to a lag in dipole orientation.

Keywords

Main Subjects

References

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Mechanics of Advanced Composite Structures
Volume 13, Issue 2 - Serial Number 28
In Progress
November 2026
Pages 347-355

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