Fabrication and Characterization of Polymer Composites Reinforced with Recycled Printed Circuit Board (PCB) Fillers

Singh, Vinay Pratap; SUNDER, SHYAM; Bhaskar, Jitendra

doi:10.22075/macs.2026.37888.1860

Fabrication and Characterization of Polymer Composites Reinforced with Recycled Printed Circuit Board (PCB) Fillers

Articles in Press

Document Type : Research Article

Authors

vinay pratap singh ¹

SHYAM SUNDER ²

Jitendra bhaskar ³

¹ Professor, ME Deptt, HBTU, Kanpur, UP

² MECHANICAL ENGINEERINFG DEPARTMENT

³ mechanical engineering department

10.22075/macs.2026.37888.1860

Abstract

The rapid growth of electronic waste has encouraged the reuse of non-metallic printed circuit board (PCB) residues as fillers in polymer composites. This work investigates high-density polyethylene (HDPE) composites reinforced with 10–30 wt% PCB powder, focusing on their mechanical and structural response. Experimental results show a substantial enhancement in stiffness, with tensile and flexural moduli increasing by up to 176% and 85%, respectively, as PCB content increases. In contrast, tensile strength and impact toughness decline, primarily due to weak filler–matrix bonding and the formation of micro-voids. SEM observations reveal irregular PCB particle morphology and interfacial defects that govern the observed mechanical degradation. FTIR and XRD analyses indicate no new phase formation but suggest constrained polymer chain mobility in the presence of rigid PCB fillers. Micromechanical predictions based on rule-of-mixtures bounds agree well with the experimental modulus values. Overall, the study demonstrates a stiffness–toughness trade-off and identifies HDPE/PCB composites as suitable for non-load-critical applications where high bending rigidity is required, offering a sustainable pathways for PCB waste utilization.

Keywords

E- waste

Environmental

Matrix

Mechanical characterization

Recycling

Subjects